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By Fewster, Paul F
Book. English.
Published London: Imperial College Press, 1999

By Fewster, Paul F
eBook. English.
Published River Edge, NJ: Imperial College Press, c2003
2nd ed

By Fewster, Paul F., author
Hardback. English.
Published New Jersey: World Scientific, [2015]
Third edition
This study provides a thorough description of the techniques involved in obtaining information about materials, including patterns

By Wong, Chiu Soon author
Thesis. English.
Published Dublin City University. School of Electronic Engineering, 2013
Traditional Si CMOS scaling following Moore’s Law is becoming increasingly difficult as physical limits are approached at sub-20 nm nodes and beyond....

By Byrne, Sarah
Thesis. English.
Published Dublin City University. School of Physical Sciences, 2003

By Allen, David, author
Thesis. English.
Published Dublin City University. School of Electronic Engineering, 2014
In the semiconductor industry, wafer handling introduces micro-cracks at the wafer edge and the causal relationship of these cracks to wafer breakage...

By Horan, Ken
Thesis. English.
Published Dublin City University. School of Electronic Engineering, 2012

By Walsh, Lee A., author
Thesis.
Published Dublin City University. School of Physical Sciences, 2014
The recently developed high energy variant of x-ray photoelectron spectroscopy(XPS), known as hard x-ray photoelectron spectroscopy (HAXPES), has been...

By Brady-Boyd, Anita, author
Thesis. English.
Published Dublin City University. School of Physical Sciences, 2018
The thesis explores the effectiveness of incorporating amino terminated self-assembled monolayers (SAMs) into several different aspects of the back-end...

By Schroder, Dieter K
Book. English.
Published New York: Wiley, c1990
This detailed sourcebook provides an up-to-date description and unified treatment of the characterization techniques used in the semiconductor industry...
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